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MPGCS-040-150-3.0 - THERMAL PAD, SILICONE, 150X3MM, BLUE - MULTICOMP PRO JST (JAPAN SOLDERLESS TERMINALS) -

SKU: 69350532880
4.1
EUR61.95 EUR82.95
MPGCS-040-150-3.0 - THERMAL PAD, SILICONE, 150X3MM, BLUE - MULTICOMP PRO JST (JAPAN SOLDERLESS TERMINALS) -
MPGCS-040-150-3.0 - THERMAL PAD, SILICONE, 150X3MM, BLUE - MULTICOMP PRO JST (JAPAN SOLDERLESS TERMINALS) -
MPGCS-040-150-3.0 - THERMAL PAD, SILICONE, 150X3MM, BLUE - MULTICOMP PRO JST (JAPAN SOLDERLESS TERMINALS) -
MPGCS-040-150-3.0 - THERMAL PAD, SILICONE, 150X3MM, BLUE - MULTICOMP PRO JST (JAPAN SOLDERLESS TERMINALS) -

Reserve from the case

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 30 - Sep 4

Description

JST (JAPAN SOLDERLESS TERMINALS) - C-1

Competence XXL II

Product Range: WSLT2010 Series

Kit Contents: NFC Tag Click Board M24SR64

MPGCS-040-150-3.0 - THERMAL PAD, SILICONE, 150X3MM, BLUE - MULTICOMP PRO JST (JAPAN SOLDERLESS TERMINALS) -Conductive Material: Silicone External Length: 150mm External Width: 150mm Product Range: Thermal Conductivity: 4W m. K Thermal Impedance: Thickness: 3mm Volume Resistivity: 1000000Mohm m

Exchange/Return Notes
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  • Final sale items are not eligible for returns or exchanges.
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